Apple’s new ‘Fusion Architecture’ was utilized for the first time when the company unveiled the M5 Pro and M5 Max, enabling the two SoCs to sport a unique chiplet design that is more advanced than the monolithic architecture that has been incorporated on previous Apple Silicon. Typically, the new chipsets would sport a 2.5D design where individual blocks are present on separate areas of the die, but one Apple employee hailing from the latter’s platform architecture mentions in the latest interview that the M5 Pro and M5 Max flaunt vertically stacked dies, which comes as a major surprise since this […]
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